AMD Announces Major Technology Partnerships at Future of Compute Event

Download as PDF

During Event Keynotes, Samsung Shows Upcoming Line of FreeSync-Enabled Ultra High-Definition Displays and Capcom Announces Evaluation of AMD Mantle API

SINGAPORE -- (Marketwired) -- 11/20/14 -- AMD (NYSE: AMD) today at its Future of Compute event announced the introduction of the consumer electronic industry's first-ever ultra high-definition (UHD) monitors to feature its innovative, open-standards based FreeSync technology. Samsung Electronics Co., Ltd., plans to launch the screen synching technology around the world in March 2015, starting with the Samsung UD590 (23.6-inch and 28-inch models) and UE850 (23.6-inch, 27-inch and 31.5-inch models), and eventually across all of Samsung's UHD lineups. FreeSync will enable dynamic refresh rates synchronized to the frame rate of AMD Radeon™ graphics cards and APUs to maximally reduce input latency and reduce or fully eliminate visual defects during gaming and video playback.

"We are very pleased to adopt AMD FreeSync technology to our 2015 Samsung Electronics Visual Display division's UHD monitor roadmap, which fully supports open standards," said Joe Chan, Vice President of Samsung Electronics Southeast Asia Headquarters. "With this technology, we believe users including gamers will be able to enjoy their videos and games to be played with smoother frame display without stuttering or tearing on their monitors."

In addition, Capcom announced its collaboration with AMD on the AMD Mantle API to enhance Capcom's "Panta-Rhei" engine, enabling enhanced gaming performance and visual quality for upcoming Capcom game titles.

"This will improve the performance of our 'Panta-Rhei' engine, which was originally developed for console platforms," said Masaru Ijuin, technical director, Capcom. "Capcom is evaluating AMD's Mantle technology to help improve the graphics pipeline, and integrate it into 'Panta-Rhei' to provide outstanding benefits and impressive performance for gamers as well as the gaming developers."

AMD's Mantle API technology has been adopted by major developers including Crytek's CRYENGINE®, DICE's FrostBite 3 and Oxide's Nitrous engine.

"Samsung and Capcom are strategic partners in helping us bring our revolutionary IP and technology to the homes and offices of consumers around the world," said David Bennett, corporate vice president, AMD APJ. "As we expand our product influence in the commercial sector, we believe open standard technologies like AMD FreeSync and software advancements like our Mantle API will play integral roles in driving the industry forward."

The Future of Compute event kicked off with the addition of the high performance processor codenamed "Carrizo" and mainstream processor codenamed "Carrizo-L" SoCs to the company's mobile Accelerated Processing Unit (APU) product roadmap. Designed as complete solutions for consumers looking to accelerate gaming and productivity applications and enable UHD 4K experiences, these latest mobile APUs are scheduled to ship in 1H 2015, with laptop and All-in-One systems expected in market by mid-year 2015.

Supporting Resources

About AMD
AMD (NYSE: AMD) designs and integrates technology that powers millions of intelligent devices, including personal computers, tablets, game consoles and cloud servers that define the new era of surround computing. AMD solutions enable people everywhere to realize the full potential of their favorite devices and applications to push the boundaries of what is possible. For more information, visit www.amd.com.

AMD, the AMD Arrow logo are trademarks of Advanced Micro Devices, Inc. Other names are for informational purposes only and may be trademarks of their respective owners.

Cautionary Statement
This document contains forward-looking statements concerning Advanced Micro Devices, Inc. ("AMD" or the "Company") including, among other things, the features, functionality and benefits of AMD FreeSync and Mantle API; the timing, availability, features and functionality of the AMD "Carrizo" APU, AMD "Carrizo-L" SoC and AMD "Carrizo"-based notebooks, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects," and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Investors are cautioned that the forward-looking statements in this document are based on current beliefs, assumptions and expectations, speak only as of the date of this document and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Risks include the possibility that Intel Corporation's pricing, marketing and rebating programs, product bundling, standard setting, new product introductions or other activities may negatively impact AMD's plans; that AMD will require additional funding and may be unable to raise sufficient capital on favorable terms, or at all; that customers stop buying AMD's products or materially reduce their operations or demand for AMD's products; that AMD may be unable to develop, launch and ramp new products and technologies in the volumes that are required by the market at mature yields on a timely basis; that AMD's third-party foundry suppliers will be unable to transition AMD's products to advanced manufacturing process technologies in a timely and effective way or to manufacture AMD's products on a timely basis in sufficient quantities and using competitive process technologies; that AMD will be unable to obtain sufficient manufacturing capacity or components to meet demand for its products or will not fully utilize its projected manufacturing capacity needs at GLOBALFOUNDRIES, Inc. (GF) microprocessor manufacturing facilities; that AMD's requirements for wafers will be less than the fixed number of wafers that it agreed to purchase from GF or GF encounters problems that significantly reduce the number of functional die it receives from each wafer; that AMD is unable to successfully implement its long-term business strategy; that the completion and impact of the 2014 Restructuring Plan and AMD's transformation initiatives could adversely affect AMD; that AMD inaccurately estimates the quantity or type of products that its customers will want in the future or will ultimately end up purchasing, resulting in excess or obsolete inventory; that AMD is unable to manage the risks related to the use of its third-party distributors and add-in-board (AIB) partners or offer the appropriate incentives to focus them on the sale of AMD's products; that AMD may be unable to maintain the level of investment in research and development that is required to remain competitive; that there may be unexpected variations in market growth and demand for AMD's products and technologies in light of the product mix that it may have available at any particular time; that global business and economic conditions will not improve or will worsen; that PC market conditions will not improve or will worsen; that PC market conditions will not improve or will worsen; that demand for computers will be lower than currently expected; and the effect of political or economic instability, domestically or internationally, on AMD's sales or supply chain. Investors are urged to review in detail the risks and uncertainties in the Company's Securities and Exchange Commission filings, including but not limited to the Quarterly Report on Form 10-Q for the quarter ended September 27, 2014.

Embedded Video Available

Embedded Video Available: http://www2.marketwire.com/mw/frame_mw?attachid=2724462

Contact:
Sophia Hong
AMD Communications (APJ)
+65-9028-9639
sophia.hong@amd.com

Antal Tungler
AMD Communications (NA)
(416) 704 3813
antal.tungler@amd.com

Source: Advanced Micro Devices

Released November 20, 2014